SkyTraq Technology, Inc. www.skytraq.com.tw Moisture Sensitivity Level 3 (MSL 3) PRECONDITIONING OF NONHERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING (From JEDEC Board Ballot JCB-02-120, and JCB-03-61, under the cognizance of the JC-14.1 Committee on Reliability Test Methods for Packaged Devices.) 1 Scope This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs (surface mount devices) that is representative of a. PC MSL3 Preconditioning 3x IR @ 260 deg C c = 0, Room Post Electrical 0/240 0/240 Post PC Electrical 0/80 0/80 500 cyc 0/80 1000 cyc 0/80 0/80 Post PC Electrical 0/80 0/80 96 hrs 0/80 Post PC Electrical 0/80 0/80 96 hrs 0/80 CDPA Custom Destructive Physical Analysis Wire Bond Pull Test following 500 cyc TC + PC Minimum 3.0 grams 30 bonds minimum 0/30 0/30 BPS Bond Pull Strength Cpk >1.33 5. Sensitivity range after MSL3 preconditioning. 4. Typical zero-g level offset value after MSL3 preconditioning. 5. Min/max at 3 sigma. Based on characterization data for a limited number of samples, not measured during final test for production. 6. Self-test positive difference is defined as: OUTPUT[mg](CTRL_REG4 (23h) ST2, ST1 bits = 01 ) - OUTPUT[mg](CTRL_REG4 (23h) ST2, ST1 bits = 00 ) in.
. 5. Typical zero-g level offset value after MSL3 preconditioning. 6. Valid if OFF_TCOMP_EN in CTRL_REG4 (23h) is set to '1'. Min/max at 3 sigma. Based on characterization data for a limited number of samples, not measured during final test for production. 7. Self-test positive difference is defined as: OUTPUT[mg](CTRL_REG4 (23h) ST2, ST1 bits = 01. Most semiconductor products are rated MSL3 or higher. MSL 1 is the highest rating where it is considered as being not moisture sensitive even at 85% RH and components rated MSL1 do not require dry packing. The MSL rating is given after product qualification and determined by the materials used in its IC packaging and assembly process is based on a constant 30°C and constant relative humidity.
Moisture sensitivity level relates to the packaging and handling precautions for some semiconductors. The MSL is an electronic standard for the time period in which a moisture sensitive device can be exposed to ambient room conditions (30 °C/85%RH at Level 1; 30 °C/60%RH at all other levels).. Increasingly, semiconductors have been manufactured in smaller sizes In mathematics, preconditioning is the application of a transformation, called the preconditioner, that conditions a given problem into a form that is more suitable for numerical solving methods. Preconditioning is typically related to reducing a condition number of the problem
Der MSL kann nach verschiedenen Verfahrensweisen festgelegt werden. Am häufigsten wird der Standard J-STD-020 (engl.Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mounted Devices) der amerikanischen Organisation JEDEC verwendet.. Für die Handhabung, Verpackung, Transport und den Einsatz feuchteempfindlicher (SMD-)Bauteile siehe J-STD-033c PRECONDITIONING REQUIREMENTS Minimum MSL3 preconditioning per JESD22‐A113 is required for surface mount capable devices that are put on TC, H3TRB/HAST, uHAST, AC, or IOL/PTC. FAILURE CRITERIA All devices parameters must pass the data sheet specification requirements. Links MSL3 Preconditioning: Moisture sensitivity level 3 pre-conditioning is performed in accordance with JEDEC JESD22-A113, lead free, 260°C peak temperature (see Appendix 1 for reflow profile). 5. Physical Dimensions: Devices are inspected to the current package outline drawing to ensure all package dimensions are within specification (see Appendix 2 for applicable outline drawings). 6.
We only get one value at +/- 2000 dps sensitivity, with a note that this is after 'MSL3 preconditioning' (MSL3 stands for Moisture Sensivity Level 3).This is worse than the earlier LSM9DS0 which listed +/-25 dps at 2000 dps sensitivity, proving that newer isn't always better MSL Preconditioning: Moisture sensitivity level pre-conditioning is performed in accordance with JEDEC JESD22-A113, lead free, 260°C peak temperature (see Appendix 1 for reflow profile). 4 MSL3 / 260˚C: TEM001092 Rev. K Page 2 of 2 Final Product/Process Change Notification Document # : FPCN21481X . Issue Date: 5 January 2017 Reliability Data Summary: QV DEVICE NAME: 0W635-004-XTD, E7120-102A59-AG. PACKAGE: 127AB 5.97x3.43, SIP59 4.14 x 3.18. Test Name Test Conditions End Point Req's. 1. Device End Point (Rej / SS) PC MSL3 Preconditioning Precondition 30°C/60%RH 192 hrs, 3x.
voltage and temperature ranges and MSL3 preconditioning. Devices from the same µModule device product family have been subjected to 1000 cycles of temperature cycles and thermal shock. ADI performs reliability testing on production lots in accordance with our Quick Reaction Reliability (QR2) Monitor Program. This monitor program is designed to provide fast feedback for possible reliability. recommended an accelerated preconditioning of 40hrs exposure under 60°C/60%RH, which is equivalent to the standard MSL-3 preconditioning. Such an accelerated test reduces the total required moisture soak time for MSL-3 by approximately a factor of five. However, the equivalency was established for leaded packages only with predominant failure mechanism of interface delamination between mold.
Module specificationsLSM330DL12/54Doc ID 022018 Rev 12Module specifications2.1Mechanical characteristicsThe values given in the following table are for the conditions Vdd = 3 V, T = 25 °C unlessotherwise noted.(a) datasheet search, datasheets, Datasheet search site for Electronic Components and Semiconductors, integrated circuits, diodes and other semiconductors Preconditioning 100% Screening LTLS MSL3 if passing gross leak is required after 60C/60%RH and 3X Reflows) *Gross leak testing is available as a chargeable event. Part Description Condition Gross Leak after Reflow Sample Size Date Results MT3-0113LCQG-2 with Ceramic Package MMIC T3 Mixer RF 1.5 - 13 MSL 1 No 8 7/26/18 Pass MT3-0113LCQG-2 with Ceramic Package MMIC T3 Mixer RF 1.5 - 13 MSL 3.
PRECONDITIONING REQUIREMENTS Minimum MSL3 preconditioning per JESD22‐A113 is required for surface mount capable devices that are put on TC, THB/HAST, uHAST, AC, or PTC. FAILURE CRITERIA All devices parameters must pass the data sheet specification requirements. Links Preconditioning JESD22-A113 MSL3 Stress Test Test Procedure Test Conditions Reliability By Design The information contained herein represents proof of Reliability and Performance of the Package Series listed below in accordance with the Qualification Plan and test methods referenced in Section 7. 0, after exposure to a variety of environments and mechanical e vents that occur during. Preconditioning MSL3 260°C, 85% RH, unbiased 1056 hrs 0 failures Temperature Humidity Bias Life Time THB 85°C,85%RH,V use 1008 hrs 0 failures Metallization Stress voiding 200°C 168 hrs 0 failures Stress Migration(stress induced voiding) 200°C 904 hrs 0 failures Corrosion THNB 168 hrs 0 failures Passivation integrity 45°C, H3PO4 or electroless NiAu 40 mn 0 failures. Conclusion • The need. Sensitivity range after MSL3 preconditioning. 5. Typical zero-g level offset value after MSL3 preconditioning. 6. Valid if OFF_TCOMP_EN in Section 7.4 CTRL_REG4 (23h) is set to '1'. Min/max at 3 sigma. Based on characterization data for a limited number of samples, not measured during final test for production. 7. Self-test positive difference is defined as: OUTPUT[mg](Section 7.4 CTRL_REG4. STRESS: TEMPERATURE CYCLE TEST, Condition C, -65 C to 150 C, with MSL3 Preconditioning FM25V20A-G 4346426 611346960 UTAC - UT 500 77 0 FM25V20A-G 4346426 611346961 UTAC - UT 500 77 0 FM25V20A-G 4346426 611346962 UTAC - UT 500 77 0. Document No. 001-93909 Rev. ** ECN #: 4481318 Document History Page Document Title: QTP #140502: QUALIFICATION OF THE SOIJ 8L (208MIL) PACKAGE AT UTL, USING 0.8MIL.
Preconditioning per JESD22-A113-D Level 3 was performed on all devices prior to reliability testing except ESD and mechanical tests. MSL3 preconditioning (JESD22-A113D): 125 C HTSL for 24hours + 60°C/60% RH for 40 hours + 3XIR reflow, 260°C peak MSL3 Preconditioning 24-hr 150C bake 192-hr 30 C, 60% RH soak 3 passes 260C solder reflow IPC/JEDEC J-STD-020 DOPL (Dynamic Operating Life) Product Lot # Package Test Duration No. Failures/Sample Size LNK460VG 7W745C eDIP-12B MSL3 +1000 hours 0/47 TOP269VG 7X399B eDIP-12B MSL3 +1000 hours 0/4 Preconditioning . ON Semiconductor adheres to JEDEC standard J-STD-020C for preconditioning requirements for surface mount packages. The JEDEC methodology utilizes a predefined moisture soak followed by three reflow soldering passes to simulate warehouse storage and a customers two-sided board assembly process plus one repair cycle. The reflow profile used by ON Semiconductor for Pb-free. Note: All units are subjected to moisture preconditioning MSL3 and 3x reflows at 260°C peak temperature prior to UHAST, HTS and TCB Table 4b: Vehicle Devices Package Type Package-Pin Count Base Die Enpirion Power SoC QFN; Q100 EM2130H01QI QFN; Q152 EM2260P01QI QFN; Q152 EM2280P01QI Contact For more information, please contact Sales in your region, or submit a Service Request at the My Intel.
Typical zero-g initial calibration tolerance value after MSL3 preconditioning 2. Please refer to the following document for further information on Self-Test: MPU-6000/MPU-6050 Register Ma 1.Preconditioning test (MSL3) apply for all kinds of package [exclude PDIP & BCC] Test procedure: 1. Initial electrical test 2. Initial acoustic microscopy 3. 40X optical microscope inspection 4. Five temperature cycles≦-40℃ to ≥ 60 ℃ 5. Bake the device 24 h at min.125 +5/-0 ℃ 6. Moisture soak, 30 ℃, 60%RH, 192 h (85 ℃, 85%RH, 168 h?) 7. Reflow (3) cycles 8. Flux, clean and dry 9. Zero-g level offset value after MSL3 preconditioning. 4. Zero-g level offset at the FS bit set to 01 and 11 is guaranteed by design. Downloaded from Arrow.com. Mechanical and electrical specifications AIS328DQ 10/43 Doc ID 18160 Rev 3 2.2 Electrical characteristics @ Vdd = 3.3 V, T = -40 °C to +105 °C unless otherwise noted(b). 5. Offset can be eliminated by enabling the built-in high-pass. This is information on a product in full production. April 2015 DocID027250 Rev 3 1/40 IIS328DQ High-performance ultra-low-power 3-axis accelerometer with digita
Tian, et al.have measured the effects of sample preconditioning (JEDEC MSL3) and cure profile on the stress-strain curves and mechanical properties of underfills, as well as the reliability of. MSL 1 Preconditioning -55C, 150C JESD22-A104 1000 cycles ; 0/77 Resistance to Solder Heat 260C ; JESD22-B016 10 sec ; 0/30 . 5 of 6. Qualification Plan Device Package Process No. of Lots. Q20150479 Q20160604 FDC6306P SSOT6 PT1 P . 1 . Test Description: Condition: Standard : Duration: Results: MSL1 Preconditioning 260C, 3 cycles JESD22-A113 NA 0/385 Un-biased Highly Accelerated Stress Test MSL. In addition, the changes in the mechanical and strength properties resulting from MSL3 and MSL2 moisture preconditioning were evaluated. The MSL preconditioning of the underfill samples included. PRECONDITIONING OF NONHERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING: JESD22-A113I Apr 2020: This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs (surface mount devices) that is representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence of this.
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Note 1: Preconditioning (J-STD-020, MSL3 @ 245C/260C) performed on all samples prior to each reliability test. Note 2: Rel#: 17060012, 17060016, 17060018/17080014, 17060027, 17060051 . Intel Corporation Page 5 of 6 12/22/2017 PCN1716 Table 5a: Vehicle Devices Package Type Package Base Die FBGA Wire Bond FBGA UBGA PBGA - 484 EP3CLS200T60 - 400 EP1C20Y13 - 88 EPC16FS35 - 672 EP1S25T13 Note. - Preconditioning conditions - e.g. 60 °C/60RH - Diffusivities for each material (die-attach, mold compound, BT, and solder mask) - Saturated moisture concentration for each material (die-attach, mold compound BT and solder mask)mold compound, BT, and solder mask) - From material characterization or supplier's data Molding Compound BT Solder Mask Die Attach Cu - Output Xuejun F Typical zero-g level offset value after MSL3 preconditioning 6. Offset can be eliminated by enabling the built-in high pass filter 7. If STM bit is used values change in sign for all axes 8. Self Test output changes with the power supply. Self test output change is defined as OUTPUT[LSb](Self-test bit on ctrl_reg1=1)-OUTPUT[LSb](Self-test bit on ctrl_reg1=0). 1LSb=4.6g/256 at 8bit. , with MSL3 245ºC Preconditioning Lot 500 Cycles 1000 Cycle
Multilayer metal RCP packages have passed 40 to 125 C air-to-air thermal cycling and HAST after MSL3/260 preconditioning. Published in: IEEE Transactions on Advanced Packaging ( Volume: 31 , Issue: 1 , Feb. 2008) Article #: Page(s): 39 - 43. Date of Publication: 07. MSL3 Preconditioning 24-hr 150 C Bake + 192-hr 30 C, 60% RH Moisture Soak + 3 Passes 260 C Solder Reflow EIA/JESD22-A113 DOPL (Dynamic Operating Life Test) Product Lot # Package Test Duration No. Failures/Sample Size LNK3206G 8S529A SMD-8C 1000 hours 0/77 LNK3206G 8T175A SMD-8C 1000 hours 0/77 LNK3206G 8T524A SMD-8C 1000 hours 0/77 THBT (Temperature Humidity Bias) Product Lot # Package Test. May 2010 Doc ID 17530 Rev 1 1/42 42 LIS3DH MEMS digital output motion sensor ultra low-power high performance 3-axes nano accelerometer Feature
2.1 Preconditioning This test consists of the following tests run in a consecutive order. The tests are electrical testing at 25°C, C- SAM , Bake 150°C 24 hour , a moisture soak, 3X Reflow cycles, C-SAM and ending with electrical testing at 25°C. 2.2 Highly Accelerated Stress Test (HAST) This test is similar to autoclave, but under more severe conditions and with the device under bias. 2.3. JEDEC Standard No. 22-A104C Page 1 Test Method A104C (Revision of Test Method A104-B) TEST METHOD A104C TEMPERATURE CYCLING (From Board Ballot JCB-00-16, and JCB-05-82, formulated under the cognizance of the JC-14. TB363Rev.5.00 Page 2 of 4 May 16, 2018 Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs) The classification test procedure involves a specified soa
The pre-conditioning rules are defined in JESD22-A113H Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing. Melexis devices intended for reflow soldering are qualified in two categories: those sensitive to moisture absorption and the associated risks (MSL3), and those that are not sensitive (MSL1). These tests are applied during product qualification and can be. Temperature Cycle / -65ºC to 150ºC Air to Air with Preconditioning @ MSL3 / 260ºC IR Reflow Lot / Mask Set 200 Cycles 500 Cycles KLM / Substr. Supplier A / 3 assy lots 0 / 246 0 / 246 KLM / Substr. Supplier B / 3 assy lots 0 / 240 0 / 240 Totals 0 / 486 0 / 486 . Device No./Rev.: MPC8241/8245, Rev. 1.4 Report Rev.: D Description: MC Qualification of MPC8241/8245 (Kahlua II) Rev. D.
MSL3'260C before THB, AC, TC SAM before and after reconditioni Preconditioning MSL3/260C + Temperature Humidity Bias 85C/85%, bias, 1000hrs Preconditioning MSL3/260C + Autoclave 121C/100%, 240hrs Preconditioning MSL3/260C + Temperature Cycle -50/+150, les, 2000 High Temperature Operating Life 150C, bias, namic, 1000hrs Wire Bond Shear Test (Ppk> 1.67) Wire Bond Pull Test .67) Solderability. Tests are preceded by MSL3 Preconditioning in accordance with JEDEC JESD22-A113F 14 Environmental Compliance The MPU-60X0 is RoHS and Green compliant. The MPU-60X0 is in full environmental compliance as evidenced in report HS-MPU-6000A, Materials Declaration Data Sheet. Environmental Declaration Disclaimer: InvenSense believes this environmental information to be correct but cannot guarantee.
* Tests were subjected to Preconditioning per JESD22-A113 prior to stress test * Temperature Cycling (-55°C to 125°C, 700 cycles) JESD22-A104 0/25 0/25 0/25 Test Description Test Method Lot 1 Lot 2 Lot 3 0/45 JESD22-A110 0/25 0/25 Ball Shear Test JESD22-B116 0/5 0/5 0/5 Bond Pull Test IDT Spec MAC-3010 0/5 0/5 0/5 * HAST - biased (130 °C/85% RH, 96 Hrs) 0/25 High Temperature Storage Bake. 1 TCB Preconditioning +Temperature Cycle J-STD-020C Moisture Sensitivity Level 3; 260°C Reflow JESD22-A104-B Condition B, 1000 cycles; -55°C to 125°C 2 TH Preconditioning + Temperature Humidity Test Un-Biased 85°C/85%R.H. MSL3, 260°C Reflow; 1000 hours 3 THB Preconditioning + Biased Temperature Humidity Test Biased 85°C/85%R.H. MSL3, 260°C Reflow Temperature; 1000 hours 4 HTS High. This is information on a product in full production. December 2015 DocID027117 Rev 2 1/41 AIS3624DQ High-performance motion sensor for automotive applications Preconditioning MSL3 at 260oC. Reliability Test Sample size Conditions Result Passed / Failed Preconditioning JESD22A113, RA 1008 50 MSL 3 at +260oC 50 / 0 Unbiased HAST JESD22A118, RA1021 25 +130oC/85%, 18 psig 48 hours 96 hours 25 / 0 25 / 0 Temperature Cycle JESD22A104 cond. C, RA 1004 25 65oC / +150oC, air to ai
Preconditioning - Required for surface mount devices +150°C Bake for 24 hours, moisture loading requirements per MSL level + 3X reflow at peak reflow temperature per Jedec STD-020E for package type; Electrical test pre and post stress at +25°C. JESD22A113. MSL3 260'C 231 15 3 738 0 15 Spares should be properly identified. 231 part MSL3, 260°C QFN, 0.65mm pitch θ JA = ~30°C/W ~4mm 2 1-4A (so far) Typical module qualification summary ** - MSL 3 Preconditioning . Typical module qualification summary Test Type . Condition/Duration . QTY Lots/Pieces . Results . Moisture Sensitivity . Level 3 as per Jedec-020 . 27 . Pass **Temp cycling -65C/150. o. C -65C/+150 C (500, 1000* Cyc) 3/77 . Pass **Unbiased HAST . 110C/85.
Preconditioning (MSL 3) 336/lot, 3 lots N/A 30°C/60% RH/192 hrs + IR x 3 (260°C) HTOL 105/lot, 3 lots 1000 hours 125°C Temp Cycle 77/lot, 3 lots 1000 cycles -55°C/125°C HAST 77/lot, 3 lots 264 hrs 110°C/85% RH Autoclave 77/lot, 3 lots 96 hrs 121°C/100% RH/15psig Thermal Shock 15/lot, 3 lots 300 cycles -55°C to 125°C . 7 RoHS-Compliant Package Qualification (cont.) RoHS-Compliant. (MSL3) JESD22- A104 -55°C to 125°C Condition B, 200 cycles 700 cycles 1000 cycles 3 lots 77 231 Temp: -40 to + 85 deg C N/A 3 lots 30 90 Note: All units are subjected to moisture preconditioning MSL3 and 3x reflows at 260°C peak temperature prior to UHAST, HTS and TCB Table 2a: Vehicle Devices: Package Type Package-Pin Count Base Die Enpirion Power SoC QFN; Q100 EM2130H01QI QFN; Q152. Preconditioning and Moisture Sensitivity Level PC JESD22-A113 MSL3 MSL3 JEDEC J-STD-020 Temperature Humidity Bias THB Multiple units, multiple lots Multiple units, multiple lots Multiple units, multiple lots Temperature Cycling TC High Temperature Storage Life HTSL Dynamic Operating Life DOPL Fab and Package Highly Accelerated Life Test HALT High Temperature Reverse Bias HTRB Packaging Process.
temperature range and tested for package level reliability (MSL3 preconditioning followed by 1000 thermal shock completed). In addition, board level reliability and power cycling have been successfully completed with the LTM4601A (15x15 mm) which incorporates very similar layout changes as previously announced. Products built using the improved design are targeted for shipment in early August. Typical zero-g level offset value after MSL3 preconditioning. 4. Offset can be eliminated by enabling the built-in high-pass filter. 5. The sign of the self-test output change is defined by CTRL_REG4 ST sign bits, for all axes. 6. The self-test output change is defined as the absolute value of: OUTPUT[LSB](CTRL_REG4 ST1, ST0 bits=01) - OUTPUT[LSB](CTRL_REG4 ST1, ST0 bits=00) 7.
Zero-g level offset value after MSL3 preconditioning. 4. Zero-g level offset at the FS bi t set to 01 and 11 is guaranteed by design. Mechanica l and e lectrical specific ations AIS328DQ. 10/43 Doc ID 1 8160 Re v 3. 2.2 Electr ical char acteristics @ Vdd = 3.3 V, T = - 40 °C t o +105 °C u nless otherwi se noted (b). 5. Offset can be eliminated by enabling the built-in high-pas s filter. 6. Reliability Test Specifications We apply the reliability tests to new products, modified products (design, production. AEC - Q100 - REV-G May 14, 2007 Component Technical Committee Automotive Electronics Council TABLE OF CONTENTS AEC-Q100 Failure Mechanism Based Stress Test Qualification for Integrated Circuit Moisture Sensitivity Level Testing. Some plastic encapsulated semiconductors are highly sensitive to moisture. If moisture gets trapped inside one of these devices and expands when heat is applied, a number of problems can arise
A Preconditioning MSL3, +60ºC / 60% RH, 52 Hrs Followed by a 3x Reflow (260°C Max) 152 152 0 B Temp Cycle -65 to +150ºC, 500 cycles, 15 min dwells 76 76 0 C UHAST +130ºC / 85% RH, 96 Hrs With no bias applied 76 76 0 G DPA External/Internal Inspection Bond Pull & Die Shear 6 6 MSL3 = Moisture sensivity level 3 preconditioning. Package Visibility Check (1) Marking Depth/Wire Loop Reliability Trials TSOP PCN: NV7009 Test Vehicle: 32 lead Test Vehicle: 28, 32, 40, 48 lead s/s = 4 units all OK s/s = 8 points x 4 units min = 20µm, max = 38 µm spec: depth < 50 µm s/s = 76 units total MSL3 + IR reflow PPT at 240h: 0/76 TCT at 500#: 0/76 SO PCN: NV8003 Test Vehicle: 44.
** SMD packages are subjected to 260C Pb-free preconditioning prior to stress (SO-8C = MSL1, eSOP-12B = MSL3) TNY4 Product Reliability Report Page 4 Power Integrations - For Intended Use Only Failure Rate: Based on a combination of the above DOPL. April 2009 Doc ID 15594 Rev 1 1/39 39 LIS35DE MEMS motion sensor 3-axis - ±2g/±8g smart digital output piccolo accelerometer Feature 2.16 V to 3.6 V supply voltage 1.8V compatible IOs < 1 mW power consumption ±2g/±8g dynamically selectable full-scale I2C/SPI digital output interface Programmable multiple interrupt generator Click and double click recognitio • Preconditioning: MSL3 according to J-STD020 • Packing: 12mm tape with 100pcs Min./reel, ø180mm (7'') N0F39S74 APPLICATIONS: • Security Camera • Motion Detection • Night Viewer • Switch Sensor • Smoke Detector : 2017: A1. 0 PRODUCT DATASHEET Ceramic High Power 3535 Series 2.9t Infrared (940nm